The Mijing iRepair MS1 Universal Module for iPhone 16 Series is a specialized expansion module designed to work with the Mijing iRepair MS1 PCB heating and desoldering platform, extending its compatibility to the newest iPhone 16 series models. This professional‑grade module allows technicians and repair specialists to precisely preheat and desolder motherboards and components from the latest iPhone devices, improving repair accuracy and reducing thermal stress on sensitive parts.

As mobile phone designs evolve with each generation, having dedicated support modules like this ensures your MS1 platform stays current with expanding model lineups especially important when working on premium flagship boards.