The MIJING Z21 MAX CPU BGA Reballing Stencil Platform is a professional chip-level repair tool designed for precise CPU reballing, BGA solder ball planting, and IC maintenance on iPhone motherboards. Featuring a high-precision magnetic positioning system and premium steel mesh stencils, it ensures accurate alignment and stable fixation during tin planting and rework procedures. Designed for iPhone A8–A19 series CPUs and various Android chipsets, the Z21 MAX delivers reliable performance, improved soldering accuracy, and efficient repair workflow for advanced microsoldering technicians.

Features

• Supports iPhone CPU reballing from A8 to A19 Pro chip series.
• Compatible with various Android CPU, Qualcomm, HiSilicon, Kirin, Exynos, and UFS chip repairs.
• High-precision CPU BGA reballing platform designed for chip tin planting and solder ball formation.
• Magnetic positioning system provides accurate alignment and stable chip fixation.
• Dual-magnet adsorption design prevents movement during reballing operations.
• Precision steel mesh stencils are calibrated according to original factory layouts.
• Rounded stencil hole design helps create fuller and more uniform solder balls.
• High-temperature resistant alloy steel construction suitable for hot air rework applications.
• Wear-resistant and metal fatigue-resistant material ensures long-term durability.
• High-precision manufacturing process minimizes burrs and stencil blockage.
• Flexible yet rigid stencil structure helps maintain shape after bending or deformation.
• Dirt-resistant surface design allows quick cleaning and maintenance.