More in BGA Flux Paste
Discover more products from this category and explore similar offerings.
Products you've recently viewed
Exclusive discounts Subscribe to our news and get a discount coupon!
Discover more products from this category and explore similar offerings.
No ratings
The images shown are for reference purposes only. Actual product packaging and materials may include additional or different information than what is displayed on our app or website. We recommend that you do not rely solely on the information provided here and that you always read product labels, warnings, and usage directions before use or consumption.
The RELIFE F‑20 Advanced Hydrogenated Flux is a high‑performance lead‑free, no‑clean soldering flux paste specially formulated for professional electronics assembly, mobile phone PCB repair, BGA rework, SMD/SMT soldering, and component tinning. Its hydrogenated rosin‑based composition delivers excellent wetting, stable solder flow, and minimal residue, making it a go‑to choice for technicians who want clean, reliable joints and reduced rework time.
SKU: N/A
Model: F-20
Net Weight: N/A
Gross Weight: N/A
Variations: 1
Serial Number: N/A
Product Size: 155 * 20 * 20 CM
Package Size: 305 * 190 * 275 CM
Discover more products from this vendor and explore their offerings.
