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RELIFE RL- 404 138°C low temperature solder paste
Ratings: 4
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The RELIFE RL-404 is a professional-grade low-temperature solder paste specifically formulated for delicate electronics repair, mobile phone motherboard work, and BGA reballing applications . With an ultra low melting point of exactly 138°C, this Sn42/Bi58 alloy paste allows technicians to perform complex repairs such as CPU reballing on iPhones without exposing surrounding components to the damaging high temperatures (typically 217°C) required by standard lead-free solders .
Key Features
- 138°C ultra-low melting point – Protects heat-sensitive components like CPUs, BGA chips, and plastic connectors during soldering
- Sn42/Bi58 alloy composition – 42% tin, 58% bismuth, lead-free and environmentally friendly
- Fine 20-38μm particle size – Ensures excellent coverage on fine-pitch components and BGA balls
- No-clean formula – Leaves minimal light gray residue; reduces post-solder cleaning time
- Optimal flux content (9-10%) – Perfect balance for smooth, reliable soldering operations
- High conductivity (14% fCu) – Guarantees efficient electrical connections
- Ideal viscosity (178 Pa.s at 25°C) – Easy to apply, stays in place without running
- Convenient 40g packaging – Ample quantity for multiple repair projects
- Storage at 5°C-10°C – Maintains paste integrity and extends shelf life
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