The KAISI 183°C Solder Paste is a professional-grade, lead-based tin paste specifically formulated for precision BGA reballing, SMD soldering, and PCB repair. This 40g syringe delivers the classic Sn63/Pb37 eutectic alloy, which melts sharply at 183°C, providing reliable performance for all standard electronics soldering applications without a plastic phase .

As the original temperature option for general repair purposes, the 183°C variants are well-regarded for their stable viscosity and strong wettability. This paste ensures bright, reliable solder joints, making it suitable for a wide range of soldering tasks, including mobile phone motherboard repairs, PCBA soldering, and SMT patching.

Key Features

• Standard 183°C Melting Point – The classic eutectic tin-lead alloy transitions sharply from solid to liquid, allowing for quicker solidification and reducing the risk of component movement during cooling, resulting in improved soldering quality .
• Sn63/Pb37 Eutectic Alloy Composition – The 63% tin and 37% lead ratio is the industry standard for SMD reflow, offering excellent wettability and a lower melting point than lead-free alternatives, making it easier to work with on standard PCBs .
• Fine Particle Size (20-38µm) – Precisely graded powder ensures even distribution, preventing stencil clogging and allowing for reliable printing on fine-pitch components, making it ideal for BGA reballing and fine-pitch SMD assembly .
• Professional Syringe Packaging – Comes in a convenient 40g syringe for easy, precise dispensing without waste, ideal for both manual application and automated dispensers .
• Strong Wettability & Oxidation Resistance – Provides excellent spreading on copper pads and component leads, ensuring strong metallurgical bonds and preventing de-wetting or dry joints.
• Non-Collapse Formula – The paste maintains its shape after application, preventing solder bridges on fine-pitch components and ensuring BGA chips stay perfectly aligned during reflow.
• Minimal Solder Balls – High-quality flux controls oxidation during reflow, significantly reducing the occurrence of stray solder beads around joints.