SOLDER PASTE KAISI 183°C
No ratings
The images shown are for reference purposes only. Actual product packaging and materials may include additional or different information than what is displayed on our app or website. We recommend that you do not rely solely on the information provided here and that you always read product labels, warnings, and usage directions before use or consumption.
The KAISI 183°C Solder Paste is a professional-grade, lead-based tin paste specifically formulated for precision BGA reballing, SMD soldering, and PCB repair. This 40g syringe delivers the classic Sn63/Pb37 eutectic alloy, which melts sharply at 183°C, providing reliable performance for all standard electronics soldering applications without a plastic phase .
As the original temperature option for general repair purposes, the 183°C variants are well-regarded for their stable viscosity and strong wettability. This paste ensures bright, reliable solder joints, making it suitable for a wide range of soldering tasks, including mobile phone motherboard repairs, PCBA soldering, and SMT patching.
Key Features
- Standard 183°C Melting Point – The classic eutectic tin-lead alloy transitions sharply from solid to liquid, allowing for quicker solidification and reducing the risk of component movement during cooling, resulting in improved soldering quality .
- Sn63/Pb37 Eutectic Alloy Composition – The 63% tin and 37% lead ratio is the industry standard for SMD reflow, offering excellent wettability and a lower melting point than lead-free alternatives, making it easier to work with on standard PCBs .
- Fine Particle Size (20-38µm) – Precisely graded powder ensures even distribution, preventing stencil clogging and allowing for reliable printing on fine-pitch components, making it ideal for BGA reballing and fine-pitch SMD assembly .
- Professional Syringe Packaging – Comes in a convenient 40g syringe for easy, precise dispensing without waste, ideal for both manual application and automated dispensers .
- Strong Wettability & Oxidation Resistance – Provides excellent spreading on copper pads and component leads, ensuring strong metallurgical bonds and preventing de-wetting or dry joints.
- Non-Collapse Formula – The paste maintains its shape after application, preventing solder bridges on fine-pitch components and ensuring BGA chips stay perfectly aligned during reflow.
- Minimal Solder Balls – High-quality flux controls oxidation during reflow, significantly reducing the occurrence of stray solder beads around joints.
